Rengo Co., Ltd. announces that it will merge Howa Sangyo Co., Ltd. and Nissio Gravure Co., Ltd. with the goal of improving the management efficiency of Rengo's consolidated subsidiaries to further enhance the Rengo Group's business performance.
Summary of merger
Merger date (effective date):
April 1, 2026 (planned)
Merger method:
The merger will be an absorption-type merger with Howa Sangyo as the surviving company, and Nissio Gravure will be dissolved. Since Howa Sangyo is merging with and absorbing its wholly owned subsidiary, no new shares will be issued in the merger, and there will be no capital increase.
At the same time as the above merger, a wholly owned subsidiary of Howa Sangyo will be established to take over the machinery sales business of Nissio Gravure.
