Meet T.CON at TAPPI CorrExpo 2023

On 28-30 August 2023 the corrugated community will get together in Cleveland, Ohio to discuss the latest industry trends and exchange ideas and experiences.

It goes without saying that T.CON will be there when the doors of the Exhibit Hall at Huntington Convention Center of Cleveland are opened and CorrExpo officially starts. Hosted by TAPPI, a forward-thinking American association with thousands of members worldwide, the event is a true go-to for everyone active in the corrugated industry.

Attendees can expect a trade show with a multitude of exhibitors as well as a broad range of topics and an agenda with different formats that ensure a variety: e.g. “What’s New? Tech Talks” sessions on recent technology trends and advancements that impact the corrugated industry. Furthermore, the program contains many interesting keynotes. Last but not least, there will be a wholesome accompanying program with diverse networking opportunities including several receptions, a golf tournament and a “Rock’n’Roll Hall of Fame” evening event.

Visit us at booth 1005 for digitalization expertise

T.CON is looking forward to meeting you at CorrExpo. Don’t forget to swing by at our booth (1005) and have a chat with us. It is our pleasure to introduce you to the profound tools for mastering the digitalization of your corrugated board production processes. Knowing well about the intense challenges for corrugated manufacturers, we love to consult you on how to become more resilient thanks to state-of-the-art software solutions fully integrated into SAP. If you like to get more information on the TAPPI CorrExpo on 28-30 August 2023, please click here for details on program and registration: CorrExpo | CorrExpo 2023